Appearance:Silver-gray paste |
Bonding Strength (260°C, 0.3mm Si Chip):1N |
Bonding Strength (260°C, 2mm Si Chip):7N |
Bonding Strength (Room Temperature, 0.3mm Si Chip):8N |
Bonding Strength (Room Temperature, 2mm Si Chip):>100N |
Chlorine Ion Content:<10ppm |
Coefficient of Thermal Expansion (above Tg):115ppm |
Coefficient of Thermal Expansion (below Tg):35ppm |
Density:3.87g/ml |
Glass Transition Temperature:127℃ |
Non-Volatile Content:98% |
Particle Size:<10μm |
Shelf Life:6months |
Sodium Ion Content:<5ppm |
Storage Humidity:<60% |
Storage Temperature:-20℃~-40℃ |
Thermal Conductivity:6.0W/m·K |
Viscosity:13000cps |
Volume Resistivity:8×10^-5Ω·cm |
剪切强度 (Mpa, PCB/PCB):10 |
外观:黑色流体 |
密度 (g/cm³):1.7 |
开放时间 (密闭状态):48hrs |
开放时间 (开封后):8hrs |
杨氏模量 (Mpa):6200 |
热膨胀系数 (TMA):35 |
热膨胀系数 > Tg (ppm/°C):82 |
玻璃化转变温度 (°C):167°C |
粘度 (cps @ 25°C):8,000 |
外观:黑色膏状 |
导热系数W/mk:0.6 |
开放时间 (天):1 |
弹性模量 (Mpa@25°C):17000 |
热膨胀系数28TMA:28 |
热膨胀系数>Tg (ppm/°C):104 |
玻璃化转变温度 (°C):148°C |
硬度 (Shore):>D85 |
粘度 (cps @ 25°C):60000~100000 |
粘接强度 (Mpa):>9 |
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